- Several nozzle jet systems spray pure water backward and forward with high-speed rotating centrifugal force to remove particle and dust on the wafer or substrate.
- Combined with high-pressure water/low-pressure atomized water to clean particle and dust on tiny wires effectively.
- For Frame form products, such as micro die (<0.5 mm2). Reduced the "Die-flying" phenomenon effectively.
- Jet pressure controllable range：15~1800 psi.
- Programmable multi-axis swing-arm system.
- Matched all Equipment Front End Module (EFEM).
- Different product carrier design, such as wafer form、Frame form、Panel form.
- Max. allowable wafer warpage：6mm.
- SEMI-S2 certification.
- Equipment model：1-chamber、2-chamber and 4-chamber.
- 2”、4“、6”、8“ and 12”.