No.536, Jianguo Rd., Yingge Dist., New Taipei City 23943, Taiwan (R.O.C.)

Wafer Scrubber

Description

  • Several nozzle jet systems spray pure water backward and forward with high-speed rotating centrifugal force to remove particle and dust on the wafer or substrate.
  • Combined with high-pressure water/low-pressure atomized water to clean particle and dust on tiny wires effectively.
  • For Frame form products, such as micro die (<0.5 mm2). Reduced the "Die-flying" phenomenon effectively.

Capacity

  • Jet pressure controllable range:15~1800 psi.
  • Programmable multi-axis swing-arm system.
  • Matched all Equipment Front End Module (EFEM).
  • Different product carrier design, such as wafer form、Frame form、Panel form.
  • Max. allowable wafer warpage:6mm.
  • SEMI-S2 certification.
  • Equipment model:1-chamber、2-chamber and 4-chamber.

Applicable

  • 2”、4“、6”、8“ and 12”.