- To handle testing wafer by mechanism. Avoid artificially caused by the wafer handling damaged.
- To detect both sides with Dual CCD simultaneously. To shorten the inspection time
- To detect both surface simultaneously and shorten the detection time.
- Defective products can be determined by RBI directly to reduce the process time.
- Wafer automatic carrier.
- Wafer applicable warpage 0-1500um.
- Fragmentation rate ≦ 1 / 10,000.
- Cassette activity holder can avoid wafer displacement.
- The backside of wafer only contact invalid edge.