No.536, Jianguo Rd., Yingge Dist., New Taipei City 23943, Taiwan (R.O.C.)

Double-side inspector with ink

Product Description

  • To handle testing wafer by mechanism. Avoid artificially caused by the wafer handling damaged.
  • To detect both sides with Dual CCD simultaneously. To shorten the inspection time

 

Product features

  • To detect both surface simultaneously and shorten the detection time.
  • Defective products can be determined by RBI directly to reduce the process time.
  • Wafer automatic carrier.
  • Wafer applicable warpage 0-1500um.
  • Fragmentation rate ≦ 1 / 10,000.
  • Cassette activity holder can avoid wafer displacement.
  • The backside of wafer only contact invalid edge.